JPS57132334A - Soldering method - Google Patents

Soldering method

Info

Publication number
JPS57132334A
JPS57132334A JP56017094A JP1709481A JPS57132334A JP S57132334 A JPS57132334 A JP S57132334A JP 56017094 A JP56017094 A JP 56017094A JP 1709481 A JP1709481 A JP 1709481A JP S57132334 A JPS57132334 A JP S57132334A
Authority
JP
Japan
Prior art keywords
projections
solder
films
thin
joined
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56017094A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6335099B2 (en]
Inventor
Kazumichi Machida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP56017094A priority Critical patent/JPS57132334A/ja
Publication of JPS57132334A publication Critical patent/JPS57132334A/ja
Publication of JPS6335099B2 publication Critical patent/JPS6335099B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/81009—Pre-treatment of the bump connector or the bonding area
    • H01L2224/8101—Cleaning the bump connector, e.g. oxide removal step, desmearing
    • H01L2224/81011—Chemical cleaning, e.g. etching, flux
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8119—Arrangement of the bump connectors prior to mounting
    • H01L2224/81193—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP56017094A 1981-02-06 1981-02-06 Soldering method Granted JPS57132334A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56017094A JPS57132334A (en) 1981-02-06 1981-02-06 Soldering method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56017094A JPS57132334A (en) 1981-02-06 1981-02-06 Soldering method

Publications (2)

Publication Number Publication Date
JPS57132334A true JPS57132334A (en) 1982-08-16
JPS6335099B2 JPS6335099B2 (en]) 1988-07-13

Family

ID=11934401

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56017094A Granted JPS57132334A (en) 1981-02-06 1981-02-06 Soldering method

Country Status (1)

Country Link
JP (1) JPS57132334A (en])

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2376201A (en) * 2001-09-26 2002-12-11 Bookham Technology Plc Joining method
US6644536B2 (en) * 2001-12-28 2003-11-11 Intel Corporation Solder reflow with microwave energy
JP2004152393A (ja) * 2002-10-30 2004-05-27 Toshiba Corp アームアッセンブリとこのアームアッセンブリを備える記憶装置及び記憶装置の製造方法
KR100459546B1 (ko) * 2002-01-16 2004-12-04 삼성전자주식회사 리플로 솔더링 방법
EP1181716A4 (en) * 1999-04-22 2006-05-24 California Inst Of Techn MICROWAVE CONNECTION OF MICROELECTROMECHANICAL COMPONENTS
CN114473114A (zh) * 2020-10-23 2022-05-13 深圳市艾贝特电子科技有限公司 一种利用微波焊接器件的焊接装置、系统及方法
CN114473112A (zh) * 2020-10-23 2022-05-13 深圳市艾贝特电子科技有限公司 一种拆焊装置、系统及方法
CN114473116A (zh) * 2020-10-23 2022-05-13 深圳市艾贝特电子科技有限公司 一种基于碟型或qfp封装器件的拆焊装置、系统及方法
CN114473113A (zh) * 2020-10-23 2022-05-13 深圳市艾贝特电子科技有限公司 多焊点同步焊接方法
CN114473115A (zh) * 2020-10-23 2022-05-13 深圳市艾贝特电子科技有限公司 一种具有密集焊点器件焊接方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0584935U (ja) * 1991-05-13 1993-11-16 スタンレー電気株式会社 液晶表示素子の駆動回路

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1181716A4 (en) * 1999-04-22 2006-05-24 California Inst Of Techn MICROWAVE CONNECTION OF MICROELECTROMECHANICAL COMPONENTS
GB2376201A (en) * 2001-09-26 2002-12-11 Bookham Technology Plc Joining method
US6644536B2 (en) * 2001-12-28 2003-11-11 Intel Corporation Solder reflow with microwave energy
US7199342B2 (en) * 2001-12-28 2007-04-03 Intel Corporation Self-aligned mechanical joint between die and substrate exposed to mixed microwave energy
KR100459546B1 (ko) * 2002-01-16 2004-12-04 삼성전자주식회사 리플로 솔더링 방법
JP2004152393A (ja) * 2002-10-30 2004-05-27 Toshiba Corp アームアッセンブリとこのアームアッセンブリを備える記憶装置及び記憶装置の製造方法
CN114473114A (zh) * 2020-10-23 2022-05-13 深圳市艾贝特电子科技有限公司 一种利用微波焊接器件的焊接装置、系统及方法
CN114473112A (zh) * 2020-10-23 2022-05-13 深圳市艾贝特电子科技有限公司 一种拆焊装置、系统及方法
CN114473116A (zh) * 2020-10-23 2022-05-13 深圳市艾贝特电子科技有限公司 一种基于碟型或qfp封装器件的拆焊装置、系统及方法
CN114473113A (zh) * 2020-10-23 2022-05-13 深圳市艾贝特电子科技有限公司 多焊点同步焊接方法
CN114473115A (zh) * 2020-10-23 2022-05-13 深圳市艾贝特电子科技有限公司 一种具有密集焊点器件焊接方法

Also Published As

Publication number Publication date
JPS6335099B2 (en]) 1988-07-13

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